The session presents recent results obtained in the area of microwave and millimeter wave measurements of material properties. It also reports on novel applicators of microwave power, material processing methods, and related modeling techniques.
This session presents recent advancements in biomedical radar technology.
Improving diagnostic accuracy for biomedical purposes is currently an intensively investigated research topic. This session will explore the latest advancements on microwave imaging, sensing and manipulation of biological samples ranging from single cells to in-vivo tissue. Application of scanning microwave microscopy, thermoacoustic imaging and lab-on-chip biosensors will be discussed for novel diagnostics and in situ monitoring approaches.
This session focuses on novel RFID system integration and applications. New backscatter modulation schemes and localization techniques are presented.
This session presents a variaty of new radar sensors and applications. The session covers applications like gesture sensing, concrete surface crack detection, sub-micrometer ranging and audio signal capture. The frequency range spans from Wi-Fi to THz.
In this session a number of innovative biosensors are presented. These include blood-pressure, heart-sound, and vital-sign sensing systems.
This session focuses on the development and advancement of chipless RFID technology. In particular the design and validation of the tags as well as new techniques for reading are presented.
Novel developments in technologies for radar systems will be discussed. These include recent advances include power amplifiers, antennas and systems that utilize them in addition to recent advances enabling integrated radar systems.
Advances in technologies that enable radar systems will be discussed. Recent advances are described in algorithms and processing for 2D imaging, distance measurements, and real-time radar. Advances that apply to cooperative, 3D imaging and lower cost radar systems are included.
Recent advances in broadband transceiver chips for both radar and communications systems will be highlighted. Advances include higher levels of integration in low-cost CMOS, moving towards massive MIMO and advances for contactless communications utilizing plastic waveguide.
This session addresses advances in mixed-signal circuits and systems. The first two presentations cover stacked CMOS topology for higher output voltage, while maintaining the RF performance in terms of bandwidth and speed for optical modulator drivers and all-digital transmitters. The other two papers introduce an inductorless high-speed digital logic family for ADCs and a near-field inductively coupled high-speed digital interconnect concept.
This session presents the newest developments in wireless communication RF front-end and system architectures that results in high capacity. This includes approaches taking advantage of broad bandwidth, high spectral efficiency modulations and spatial diversity. In particular, millimeter wave, MIMO and beamforming communication systems will be discussed.
This session focuses on recent research on non-destructive microwave sensing of material properties for a variety of applications, including near-field imaging, dielectric spectroscopy, eye tracking, and fluid-leakage detection.
This session discusses the latest advances in RF and millimeter-wave interconnects and packaging. The first paper focuses on tiled 5G module on LTTC with integrated micro-channels. The second paper discusses micro-coaxial cables for high density integration and 3D interconnects. The third paper focuses on D-band waveguide to CPW transitions. The last two papers focus on novel antenna-based interconnects and on-textile integration.
This session highlights innovations in active phased array systems from state-of-the-art industrial and academic recent accomplishments. Scalable and modular phased array systems for communication applications are presented. In particular, phased array systems for satellite communications, 5G, millimeter-wave Gbps applications will be presented.
Several wireless power transfer systems and innovative test bed for rectantenna characterization are presented in this session. Industrial and space applications are considered, along with a low-power receiver and an experimental platform for non conventional excitations.
This session highlights recent advances in 3D printed RF components and interconnects. A squeezed spherical cavity is presented that uses a rectangular slot for higher order mode suppression. Then an integrated transition between suspended rectangular coaxial lines to rectangular waveguide is shown. Novel interconnects including a laser-enhanced direct-printed CPW line operating up to 110 GHz is demonstrated, while a coaxial-to-two parallel wireline is tested up to 40 GHz. The session concludes with a novel helical-based microstrip transmission line enabling phase implementation in fixed length structures.
This session focuses on techniques for self-test and calibration of phased array systems, interference mitigation for digital arrays, novel components for beam forming and integrated T/R modules.
Recent advanced in rectenna and rectenna systems, such as millimeter differential rectifier in CMOS technology and high gain and large beamwidth harvsters with Iot and 5G applications.
This session features papers that focus on novel RF components and modules that have been realized using additive manufacturing techniques. One paper focuses on an origami frequency selective surface structure that is integrated with thermal actuation mechanisms. A second origami design is based on a 3D-printed foldable substrate. The third paper is a microfluidics-based 3D-printed Butler matrix in coaxial technology. The session concludes with a demonstration of an embedded-on-package 5G energy harvester system.
Systems designed over a broad frequency range are introduced in the presence of lossy media such as sea water and biological issuee. Single-band and multi-band solutions are proposed employing machine learning approach