Emerging Technical Areas

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Theodore Reck
Virginia Diodes Inc.
Adrian Tang
Jet Propulsion Lab
Location
403B
Abstract

This session presents the latest work on transmitter components including the power amplifiers and frequency multipliers operating at mm-wave and sub-mm-wave frequencies.

Technical Papers
Abstract
We1C-1: A 99 - 132 GHz Frequency Quadrupler with 8.5 dBm Peak Output Power and 8.8% DC-to-RF Efficiency in 130 nm BiCMOS
Kefei Wu, Muhammad Waleed Mansha, Mona Hella
Muhammad Waleed Mansha, Rensselaer Polytechnic Institute
(08:00 - 08:20)
Abstract
We1C-2: A 135-183 GHz Frequency Sixtupler in 250 nm InP DHBT Process
Mingquan Bao, Thanh Ngoc Thi Do, Dan Kuylenstierna, Herbert Zirath
Mingquan Bao, Ericsson
(08:20 - 08:40)
Abstract
We1C-3: Broadband and High-Gain 400-GHz InGaAs mHEMT Medium-Power Amplifier S-MMIC
Bersant Gashi, Laurenz John, Dominik Meier, Markus Rösch, Axel Tessmann, Arnulf Leuther, Hermann Massler, Michael Schlechtweg, Oliver Ambacher
Bersant Gashi, Fraunhofer Institute for Applied Solid State Physics
(08:40 - 09:00)
Abstract
We1C-4: A 160-183 GHz 0.24-W (7.5% PAE) PA and 0.14-W (9.5% PAE) PA -- High-Gain, G-band Power Amplifier MMICs in 250-nm InP HBT
Zach Griffith, Miguel Urteaga, Petra Rowell, Lan Tran
Zach Griffith, Teledyne Scientific
(09:00 - 09:20)
Abstract
We1C-5: A 140GHz power amplifier with 20.5dBm output power and 20.8% PAE in 250-nm InP HBT technology
Ahmed Ahmed, Munkyo Seo, Ali Farid, Miguel Urteaga, James Buckwalter, Mark Rodwell
Ahmed Ahmed, Univ. of California, Santa Barbara
(09:20 - 09:40)

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Samet Zihir
Renesas Electronics Corp.
Herbert Zirath
Chalmers Univ. of Technology
Location
403B
Abstract

This session includes latest work covering high-data-rate wireless transceivers and receivers as well as mm-wave radars.

Technical Papers
Abstract
We2C-1: A 300GHz Wireless Transceiver in 65nm CMOS for IEEE802.15.3d Using Push-Push Subharmonic Mixer
Ibrahim Abdo, Takuya Fujimura, Tsuyoshi Miura, Korkut Tokgoz, Hiroshi Hamada, Hideyuki Nosaka, Atsushi Shirane, Kenichi Okada
Ibrahim Abdo, Tokyo Institute of Technology
(10:10 - 10:30)
Abstract
We2C-2: 100 Gbps 0.8-M Wireless Link based on Fully Integrated 240 GHz IQ Transmitter and Receiver
Mohamed Eissa, Nebojsa Maletic, Eckhard Grass, Rolf Kraemer, Dietmar Kissinger, Andrea Malignaggi
Mohamed Eissa, IHP Microelectronics
(10:30 - 10:50)
Abstract
We2C-3: Wireless Communication Using Fermi-level-managed Barrier Diode Receiver with J-band Waveguide-input Port
Tadao Nagatsuma, Fumiya Ayano, Keita Toichi, Li Yi, Masamichi Fujiwara, Noriko Iiyama, Junichi Kani, Hiroshi Ito
Tadao Nagatsuma, Osaka Univ.
(10:50 - 11:10)
Abstract
We2C-4: A 680 GHz Direct Detection Dual-Channel Polarimetric Receiver
Caitlyn Cooke, Kevin Leong, Khanh Nguyen, Alfonso Escorcia, Gerry Mei, Jennifer Arroyo, Taylor Barton, Cornelis Du Toit, Giovanni De Amici, Dong Wu, William Deal
Caitlyn Cooke, Univ. of Colorado
(11:10 - 11:30)
Abstract
We2C-5: Flexible Radar Front End with Multimodal Transition at 300 GHz
Martin Geiger, Simon Gut, Philipp Hügler, Christian Waldschmidt
Martin Geiger, University of Ulm
(11:30 - 11:50)

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Rhonda Franklin
Univ. of Minnesota, Twin Cities
Florian Herrault
HRL Laboratories, LLC
Location
404AB
Abstract

RF, mm-wave, and THz subsystems can benefit from heterogeneous integration of dissimilar component technologies for improved performance and signal integrity. At such frequencies, innovation in design, nano-materials and fabrication is crucial; high-frequency intra-chip interconnects and flip chip technologies will be presented.

Technical Papers
Abstract
Th1D-1: Polylithic Integration for RF/MM-Wave Chiplets using Stitch-Chips: Modeling, Fabrication, and Characterization
Ting Zheng, Paul Jo, Sreejith Kochupurackal Rajan, Muhannad Bakir
Ting Zheng, Georgia Institute of Technology
(08:00 - 08:20)
Abstract
Th1D-2: A W-Band Chip-to-Printed Circuit Board Interconnect
Björn Deutschmann, Arne Jacob
Björn Deutschmann, Hamburg Univ. of Technology
(08:20 - 08:40)
Abstract
Th1D-3: A Low-Loss Balun-Embedded Interconnect for THz Heterogeneous System Integration
Te-Yen Chiu, Yu-Ling Lee, Chun-Lin Ko, Sheng-Hsiang Tseng, Chun-Hsing Li
Te-Yen Chiu, National Tsing Hua Univ.
(08:40 - 09:00)
Abstract
Th1D-4: W Band Carbon Nanotubes Interconnects Compatible with CMOS Technology
Philippe Roux-Levy, Joseph De Saxce, Chun Fei Siah, Jianxiong Wang, Beng Kang Tay, Philippe Coquet, Dominique Baillargeat
Joseph De Saxce, Xlim - CNRS- Unversite De Liroges
(09:00 - 09:20)
Abstract
Th1D-5: Suspended SiC Filter with DRIE Silicon Subcovers
Elizabeth Kunkee, Dah-Weih Duan, Andrew Sulian, Peter Ngo, Nancy Lin, Chunbo Zhang, Dino Ferizovic, Charles Jackson, Rich Lai
Elizabeth Kunkee, Northrop Grumman Corp.
(09:20 - 09:40)