This session presents the latest work on transmitter components including the power amplifiers and frequency multipliers operating at mm-wave and sub-mm-wave frequencies.
This session includes latest work covering high-data-rate wireless transceivers and receivers as well as mm-wave radars.
RF, mm-wave, and THz subsystems can benefit from heterogeneous integration of dissimilar component technologies for improved performance and signal integrity. At such frequencies, innovation in design, nano-materials and fabrication is crucial; high-frequency intra-chip interconnects and flip chip technologies will be presented.