Active and passive sensors for liquids and biomaterials, ranging from biological cells to fuels, are discussed. Considered devices are based on CMOS, iSMM and SIW technologies.
This session focuses on the latest advances in microwave semiconductor devices. Gallium Nitride transistor advancements in power, efficiency, and 3D heterogeneous integration are highlighted. In addition, sub-100nm metamorphic HEMT noise performance and emerging high power diamond-based diodes are discussed.
Techniques of non-destructive evaluation of diverse dielectric materials are discussed. Imaging systems based on resonant and broadband applicators are presented.
Improving sensing accuracy for biomedical purposes is currently an intensively investigated research topic. This session will explore the latest advancements on microwave sensing devices, implantable antenna systems and the effect of RF exposure on biological samples. The application of microwave on wearable devices for in-body sensing, speech reconstruction using microwave sensing and wireless powering of deep body implants will be discussed for novel biomedical sensing approaches.
This section discusses recent advancements in biomedical radar and imaging technologies for non-contact detection and monitoring. Applications include knee prostheses imaging, blood pressure monitoring, human tracking, respiratory and heartbeat monitoring.
Advances in SiGe, CMOS and GaN technology have lead to the widespread availability of low-cost millimeter wave radar transceivers. These sensors has enabled new capabilities in vibrometry and small scale motion sensing. Advances in this session include FMCW sensing of multiple targets, AI driven gesture recognition, picosecond pulse and interferometric techniques capable of resolving vibration ambiguities, and novel motion compensation approaches for vibrometry of moving targets.
New degrees of freedom are achieved using three-dimensional manufacturing approaches in high-frequency design. Deformable, integrable and extremely small dimensions can be enabled in components and systems using novel materials and processes. Some of the latest advancements on three-dimensional interconnects and RF components will be presented in the mm-wave to the THz regime.
In-band full-duplex, also known as same-frequency simultaneous transmit and receive, requires self-interference cancellation to enable practical operation. This session will present papers on advanced RF/analog cancellers as well as highly-integrated transceivers that provide suppression across multiple domains. These novel techniques and systems should help advance the field of in-band full-duplex, and move the technology towards adoption within a future wireless standard.