The talk will survey the state-of-the-art of devices, circuits, and integration technologies required for future ultra broadband microwave and mixed-mode electronics for RF System-On-Chip (SoC) applications. The talk will illustrate critical technical challenges and or practical tradeoffs of various technology options, such as SiGe BiCMOS, RF CMOS, III-V electronics, and heterogeneously-integration technologies to deliver ultra high capacity wireless data beyond 5G wireless.