Heterogeneous Integration Using the Dielet Approach for IoT and 5G

IoT and 5G applications are better optimized using heterogeneous technologies that leverage a variety of sensor and MEMS technologies and broad base of semiconductor technologies and materials that are constrained by extremely compact form factors, in some cases flexibility, low energy use, and significant thermal dissipation challenges. In this talk we will explain how recent advances in packaging such as the Silicon Interconnect Fabric (Si-IF) and Flexible Hybrid Electronics (FHE) using FlexTrate(tm) attempt to address these challenges.