mm-Wave Packaging and Antenna Integration for 5G Applications and Beyond

mm-Wave technologies are expected to be a game changer in delivering high-speed data wirelessly for the next generation wireless and mobile communication standards. In those emerging applications, the microelectronic package plays a major role as it becomes the preferred medium for integrating antennas and other critical RF circuits. For 5G, WiGig and radar applications the antenna performance directly impacts the power efficiency and with it the ultimate user experience. This presentation will focus on various high-frequency substrate technologies targeting the 5G frequencies around 60GHz. Individual antennas as well as complete phased array modules integrated on both organic and non-organic substrates will be discussed.