Packaging and Integration Solutions at Terahertz Frequencies

Packaging and interconnecting components and devices is difficult at mm-waves due to excessive losses at these frequencies with traditional techniques. The problem gets multiplied manifold when it comes to terahertz frequencies. In this paper, several novel interconnecting and packaging techniques at terahertz frequencies will be described. It will be shown that micromachined packaging is emerging as the best choice for the development of advanced terahertz systems.