Preliminary Observation on Wafer-Level Terahertz Packaging and Heterogeneous Integration

Advances in solid-state technologies is enabling practical adaptation of terahertz (THz) and sub-terahertz spectrum for imaging, security and wireless communication applications. This talk outlines some of the state-of-the-art challenges associated with 3-dimensional FOWLP packaging and integration using FOLWP in the 70–300GHz spectrum. Emerging concepts regarding antennas, interconnects, characterization, and integration will be discussed in detail