Application of Heterogenous Integration to Advanced Transceivers and mm-Wave Phased Arrays

While most applications benefit from the large-scale integration that silicon technology affords, many stressing DoD applications also require the addition of higher transmit power, lower noise figure, or increased bandwidth that compound semiconductors can provide. At higher frequencies, printed circuit boards (PCB) or integrated microwave assemblies (IMA) can become challenging to implement often increasing the overall size and potentially decreasing the performance. This talk will present the use of heterogenous integration to integrate high performance compound semiconductors in close proximity to advanced CMOS for overall improved microwave performance.