Thermal and Mechanical Co-Design for Packaging in 5G Systems

Advanced packaging of electronic devices require new developments in design tools to enable these technologies to meet the requirements for 5G systems and the benefits these systems will provide: high data rates, low latency, and massive number of connections. To fully understand the design, materials, and device requirements for these technologies, there is a need for co-design methodologies across the device (Si, GaN, GaAs, etc), package, and system workflows. This paper will discuss current state-of-the-art in co-design for advanced packaging with a focus on thermal and mechanical analysis and the challenges that need to be overcome for 5G systems.