Design and Fabrication of SIW at mm-Wave using Organic Substrates

As is well known, Substrate Integrated Waveguides (SIW) provide for a viable way of feeding antennas and other components in Front-End Modules (FEM). Most of the work in this area has been confined to <40GHz using standard printed circuit board technologies. At these frequencies, the size of these SIWs can be large. More recently, demonstration of SIWs using ceramic technologies have been demonstrated in the 60GHz band. In this presentation our focus will be on the use of multi-layered organic substrates to implement SIWs for higher frequencies beyond 5G (such as 6G) arising in applications such as imaging, MIMO communication etc operating above 100GHz. A few SIW implementations are available at these frequencies but confined to silicon technologies. Use of organic substrates provides for much lower insertion loss while providing a scheme for reducing the overall noise figure of the system. In this presentation we will discuss the effects of surface roughness, its electromagnetic modeling, methods for reducing the surface roughness effect, introducing air in the waveguide, implementation of half mode structures etc with a goal of reducing the insertion loss such that they are better or comparable to other interconnect structures such as microstrip at these frequencies. In addition, discussion on the optimization of these structures using machine learning techniques will be discussed.