Wafer Level Packaging Technologies for High Frequency Device Applications

Wafer Level Packaging (WLP) is semiconductor component packaging, where packaging processes are applied to wafers or reconstructed wafers, has been become omnipresent in recent years. Due the small package size, WLP is particularly popular for mobile products. Moreover, due to smaller features and standoff compared to larger package formats, the advantages of WLP extend to electrical, thermal and in some cases mechanical performance. In this talk, we will review common process flows and materials and how they impact on package characteristics. Special attention will be given to RF applications ranging from 2.5GHz bands for Bluetooth and WLAN to bands near 80GHz for automotive radar.